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- INTEL EXTREME TUNING UTILITY OVERCLOCK SETTINGS I5 3570K MANUAL
- INTEL EXTREME TUNING UTILITY OVERCLOCK SETTINGS I5 3570K SERIES
We still managed a +1.1 GHz overclock easily enough, although +0.175 volts was required.Īt 4.1 GHz, peak power is +104W over the system power draw at stock, with another 40W at 4.3 GHz. This time we were unable to monitor temperatures due to a BIOS issue, but had a power meter on hand. The voltage needed early on in the overclock went up quickly. Unfortunately our second sample was pretty much a dud by comparison. The sweet spot for this CPU seems to be at around 4.4 GHz where the CPU voltage is just starting to rise but peak temperatures are under 75✬. It has been a long while since numbers like +36.7% has been bandied around Intel’s extreme range, with only the i7-920 type Nehalem CPUs doing that sort of overclock in its stride. The first sample has a lot of early headroom with +0.100 volts allowing for an extra +1.1 GHz, or a 36.7% overclock. Where load line calibration was possible, it was enabled to match our setting as closely as possible, but otherwise only the CPU voltage was adjusted. Standard turbo modes allow 3.5 GHz, and so we start our testing at 3.5 GHz on all cores at 1.000 volts set in the BIOS. The i7-5960X for reference is a 3.0 GHz base clock CPU with 8 cores, with a stock load voltage around 1.050 volts. Both of these were M0 stepping samples, the same as the retail stepping as far as we understand. Our test bed is not in a case, which should push overclocks higher with fresher (cooler) air.ĭue to the timing of our testing, we were only able to test two i7-5960X CPUs. The CPU voltage is increased gradually until the stability tests are passed, and the process repeated until the motherboard reduces the multiplier automatically (due to safety protocol) or the CPU temperature reaches a stupidly high level (100✬+).
INTEL EXTREME TUNING UTILITY OVERCLOCK SETTINGS I5 3570K MANUAL
These stability tests aim to catch any immediate causes for memory or CPU errors.įor manual overclocks, based on the information gathered from stock testing, we start at a nominal voltage and CPU multiplier, and the multiplier is increased until the stability tests are failed. We select the overclock options and test for stability with PovRay and OCCT to simulate high-end workloads. Our standard overclocking methodology is as follows. In fact I was seeing less than 30✬ while idle, which should bode well for overclocking. In our results below we are using a Cooler Master Nepton 140XL closed loop liquid CPU cooler, and following the instructions above our CPU temperatures stay extremely low until we pile on the overclock. This helps remove air bubbles as the TIM spreads spreading it out manually leads to air bubbles all over the place and is not recommended for high thermal sources. I would advise the normal procedure of applying thermal paste here: a small blob in the middle and allow the heatsink to spread the TIM through applied pressure.
INTEL EXTREME TUNING UTILITY OVERCLOCK SETTINGS I5 3570K SERIES
Also due to the way that the epoxy is handled, the heatspreader cannot be removed without force and destroying parts the silicon die.ĭue to the way that the CPU is arranged, with the cores to the left and right of center, there may develop a series of recommendations when using different methods of applying thermal paste as the sources of the heat will most likely be in these two regions. Looking through the previous generations, Sandy-E, Ivy-E and Haswell-E shows this hole, which is typically thought to allow for expansion of the heatspreader and/or gas trapped inside due to the heat. Although recent reports suggest that Intel is using an epoxy to bind the die to the heatspreader, one tell-tale sign that a goopy TIM is not being used is the hole in the heatspreader in one of the corners. Thankfully Intel has not decided to play around with the extreme edition platform too much since Nehalem. This caused enough of a talking point for Intel to release Devil’s Canyon (read our review here) which featured an upgraded interface and essentially reduced the thermal pressure restricting the overclock.
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One of the burgeoning questions relating to overclocking over the past couple of years has been the quality of Intel’s construction under the heatspreader relating to thermal interface material and adhesives.